JINXING MATECH CO LTD

JINXING MATECH is an expert provider on the metal solution. Especially on the products such as Tungsten Alloy , Tungsten copper , Titanium , Zirconium, Vanadium, Hafnium, Sputtering target , Nobel

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Heat Sink Package Tungsten Copper Alloy Polished Grinding

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JINXING MATECH CO LTD
Country/Region:china
Contact Person:MrZHANG
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Heat Sink Package Tungsten Copper Alloy Polished Grinding

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Brand Name :JINXING
Model Number :Copper Tungsten / WCu alloy
Certification :ISO 9001
Place of Origin :China
MOQ :5KGS
Payment Terms :L/C, D/A, D/P, T/T, Western Union
Supply Ability :10000kgs/M
Delivery Time :10~25 work days
Packaging Details :Plywood Case
Material :Tungsten Copper
Surface :Polished and Grinding
Content :W75, W85, W80, W55, W65, W90
Dimensions :Customized
Density :12.2~17g/cm3
Application :Resistance Welding , Spot Welding
Type :RWMA Class 10,Class 11, Class 12
Grade :1W3, 3W3 , 5W3, 10W3 , 30W3 ,3W53,10W53
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Tungsten Copper Heat Sink Package Sheet,Tungsten Copper Shim,Tungsten Copper Sheet

Product Introduction:

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience

Tungsten Copper Heat Sink Package Sheet Advantages

· High thermal conductivity

· Excellent hermeticity

· Excellent flatness, surface finish, and size control

· Semi-finished or finished (Ni/Au plated) products available

Tungsten Copper Heat Sink Package Sheet are used to conduct heat away from computer chips and integrated circuits, preventing thermal damage. Depending on the electronic device, heat sinks come in different sizes and shapes. Tungsten-copper composites, with copper content (by weight) of 15 to 20 percent, are often used to make heat sinks. Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.

hysical Properties of Major Products

Mark Wt%(W) Wt%(Cu) Density
at 20ºC
Thermal conductivity at 25ºC Coefficient of thermal expansion at 20ºC
W90Cu10 90±1 rest 17.0g/cm3 180-190 6.5
W85Cu15 85±1 rest 16.4g/cm3 190-200 7.0
W80Cu20 80±1 rest 15.6g/cm3 200-210 8.3
W75Cu25 75±1 rest 14.9g/cm3 220-230 9.0
W50Cu50 50±1 rest 12.2g/cm3 310-340 12.5

Tungsten Copper Heat Sink Package Sheet Picture

Heat Sink Package Tungsten Copper Alloy Polished GrindingHeat Sink Package Tungsten Copper Alloy Polished Grinding

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